Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410882 | Method of forming semiconductor device having a dual material redistribution line and semiconductor device | Anhao Cheng | 2022-08-09 |
| 11373970 | Semiconductor device having a redistribution line | Anhao Cheng, Sheng-Wei Yeh | 2022-06-28 |