Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532573 | Method for forming semiconductor device | Huan-Neng Chen | 2022-12-20 |
| 11508677 | Semiconductor package for high-speed data transmission and manufacturing method thereof | Huan-Neng Chen | 2022-11-22 |
| 11502402 | Integrated patch antenna having insulating substrate with antenna cavity and high-K dielectric | Feng-Wei Kuo, Ching-Hui Chen | 2022-11-15 |
| 11500155 | Optical coupler, grating structure and forming method thereof | Feng-Wei Kuo | 2022-11-15 |
| 11495528 | Method of fabricating device having inductor | — | 2022-11-08 |
| 11450595 | Semiconductor package device with integrated inductor and manufacturing method thereof | Ying-Chih Hsu | 2022-09-20 |
| 11442296 | Waveguide structure and method for forming the same | Huan-Neng Chen, Feng-Wei Kuo, Min-Hsiang Hsu, Lan-Chou Cho, Chewn-Pu Jou | 2022-09-13 |
| 11428870 | Semiconductor structure and method of fabricating the same | Feng-Wei Kuo | 2022-08-30 |
| 11417594 | 3DIC package integration for high-frequency RF system | — | 2022-08-16 |
| 11380632 | Semiconductor package device with integrated inductor and manufacturing method thereof | Huan-Neng Chen | 2022-07-05 |
| 11362026 | Embedded metal insulator metal structure | Feng-Wei Kuo | 2022-06-14 |
| 11295979 | Semiconductor package device with integrated antenna and manufacturing method thereof | Feng-Wei Kuo, Chih-Hang Tung, Chen-Hua Yu | 2022-04-05 |