Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502032 | Chip package and method of fabricating the same | An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2022-11-15 |
| 11416666 | Integrated circuit and method for forming the same | Ming-Fang Lai, Yi-Feng Chang | 2022-08-16 |
| 11231613 | Display apparatus | Wei-Ming Cheng, Min-Hsuan Chiu | 2022-01-25 |