Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373956 | Semiconductor device package and method of manufacturing the same | Min-Lung Huang, Hsin Hsiang Wang, Chih-Wei Huang, Shiuan-Yu LIN | 2022-06-28 |
| 11264262 | Wafer debonding and cleaning apparatus | Wen-Chih Chiou, Yu-Liang Lin | 2022-03-01 |