Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373956 | Semiconductor device package and method of manufacturing the same | Min-Lung Huang, Hung-Jung Tu, Hsin Hsiang Wang, Chih-Wei Huang | 2022-06-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373956 | Semiconductor device package and method of manufacturing the same | Min-Lung Huang, Hung-Jung Tu, Hsin Hsiang Wang, Chih-Wei Huang | 2022-06-28 |