Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264262 | Wafer debonding and cleaning apparatus | Wen-Chih Chiou, Hung-Jung Tu | 2022-03-01 |
YL
Yu-Liang Lin
Overall (2022): #192,624 of 548,613Top 40%
1
Patents 2022