Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11329006 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Po-Yao Lin, Kuo-Chuan Liu | 2022-05-10 |
FL
Fu-Jen Li
Overall (2022): #452,826 of 548,613Top 85%
1
Patents 2022