ST

Shu-Jung Tseng

TSMC: 1 patents #1,889 of 3,577Top 55%
📍 Zhumaoya, TW: #17 of 21 inventorsTop 85%
Overall (2022): #258,325 of 548,613Top 50%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11251114 Package substrate insulation opening design Shyue-Ter Leu 2022-02-15