Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11329008 | Method for manufacturing semiconductor package for warpage control | Chen-Shien Chen, Ming-Da Cheng, Ming-Chih Yew | 2022-05-10 |
YS
Yu-Tse Su
Overall (2022): #191,108 of 548,613Top 35%
1
Patents 2022