Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456266 | Bump structure and method of manufacturing bump structure | Ching-Yu Chang, Ming-Da Cheng | 2022-09-27 |
| 11281107 | Method for performing lithography process with post treatment | Ching-Yu Chang, Chin-Hsiang Lin | 2022-03-22 |