Issued Patents 2022
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532531 | Semiconductor package | Po-Han Wang, Hung-Jui Kuo, Sih-Hao Liao | 2022-12-20 |
| 11532540 | Planarizing RDLS in RDL-first processes through CMP process | Po-Han Wang, Hung-Jui Kuo, Chen-Hua Yu | 2022-12-20 |
| 11456280 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao, Hung-Chun Cho | 2022-09-27 |
| 11454888 | Semiconductor device and method of manufacture | Sih-Hao Liao, Hung-Jui Kuo, Chen-Hua Yu | 2022-09-27 |
| 11450603 | Semiconductor device and method of fabricating the same | Sih-Hao Liao, Hung-Jui Kuo | 2022-09-20 |
| 11422070 | Sampling probe, automatic sampling device, and container detection system | Qingjun Zhang, Yuanjing Li, Zhiqiang Chen, Jianmin Li, Shangmin Sun +7 more | 2022-08-23 |
| 11417582 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao, Hung-Chun Cho | 2022-08-16 |
| 11404342 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo +3 more | 2022-08-02 |
| 11393749 | Stacked via structure | Po-Han Wang, Hung-Jui Kuo | 2022-07-19 |
| 11355378 | Fan-out interconnect structure and methods forming the same | Chung-Shi Liu, Hung-Jui Kuo, Ming-Da Cheng | 2022-06-07 |
| 11342296 | Semiconductor structure, semiconductor package and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao, Po-Han Wang | 2022-05-24 |
| 11322450 | Chip package and method of forming the same | Chen-Hua Yu, Hung-Jui Kuo | 2022-05-03 |
| 11322360 | Method of manufacturing semiconductor structure | Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2022-05-03 |
| 11289426 | Semiconductor package and manufacturing method thereof | Yung-Chi Chu, Hung-Jui Kuo, Jhih-Yu Wang | 2022-03-29 |
| 11289396 | Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Sih-Hao Liao, Tian Hu | 2022-03-29 |
| 11282804 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao | 2022-03-22 |
| 11276647 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Hung-Jui Kuo | 2022-03-15 |
| 11270927 | Package structure and method of forming the same | Hung-Chun Cho, Hung-Jui Kuo, Sih-Hao Liao, Wei-Chih Chen | 2022-03-08 |
| 11227795 | Integrated circuit package and method | Ting-Chen Tseng, Sih-Hao Liao, Po-Han Wang, Hung-Jui Kuo | 2022-01-18 |