Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289396 | Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Tian Hu | 2022-03-29 |
| 11289426 | Semiconductor package and manufacturing method thereof | Hung-Jui Kuo, Jhih-Yu Wang, Yu-Hsiang Hu | 2022-03-29 |
| 11276647 | Method of forming semiconductor device | Jhih-Yu Wang, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-03-15 |