Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532531 | Semiconductor package | Po-Han Wang, Hung-Jui Kuo, Yu-Hsiang Hu | 2022-12-20 |
| 11456280 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Hung-Chun Cho | 2022-09-27 |
| 11454888 | Semiconductor device and method of manufacture | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2022-09-27 |
| 11450603 | Semiconductor device and method of fabricating the same | Hung-Jui Kuo, Yu-Hsiang Hu | 2022-09-20 |
| 11417582 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Hung-Chun Cho | 2022-08-16 |
| 11404342 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo +3 more | 2022-08-02 |
| 11342296 | Semiconductor structure, semiconductor package and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Po-Han Wang | 2022-05-24 |
| 11289396 | Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Tian Hu | 2022-03-29 |
| 11282804 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu | 2022-03-22 |
| 11276647 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-03-15 |
| 11270927 | Package structure and method of forming the same | Hung-Chun Cho, Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen | 2022-03-08 |
| 11227795 | Integrated circuit package and method | Ting-Chen Tseng, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-01-18 |