Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532531 | Semiconductor package | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2022-12-20 |
| 11532540 | Planarizing RDLS in RDL-first processes through CMP process | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2022-12-20 |
| 11393749 | Stacked via structure | Hung-Jui Kuo, Yu-Hsiang Hu | 2022-07-19 |
| 11342296 | Semiconductor structure, semiconductor package and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2022-05-24 |
| 11309265 | Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Ing-Ju Lee, Chao-Lung Chen, Cheng-Ming Wu | 2022-04-19 |
| 11227795 | Integrated circuit package and method | Ting-Chen Tseng, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-01-18 |