Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401624 | Plating apparatus and method for electroplating wafer | Che-Min Lin, Hung-San Lu, Chao-Yuan Chang, Chun-An Kung, Chin-Hsin Hsiao +3 more | 2022-08-02 |
| 11309265 | Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Po-Han Wang, Ing-Ju Lee, Cheng-Ming Wu | 2022-04-19 |