Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401624 | Plating apparatus and method for electroplating wafer | Che-Min Lin, Hung-San Lu, Chao-Lung Chen, Chun-An Kung, Chin-Hsin Hsiao +3 more | 2022-08-02 |
| 11264393 | Source/drain contact having a protruding segment | Jui-Lin Chen, Ping-Wei Wang, Fu-Kai Yang, Ting Fang, I-Wen Wu +1 more | 2022-03-01 |