Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401624 | Plating apparatus and method for electroplating wafer | Che-Min Lin, Chao-Lung Chen, Chao-Yuan Chang, Chun-An Kung, Chin-Hsin Hsiao +3 more | 2022-08-02 |
HL
Hung-San Lu
Overall (2022): #427,535 of 548,613Top 80%
1
Patents 2022