Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309265 | Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Po-Han Wang, Chao-Lung Chen, Cheng-Ming Wu | 2022-04-19 |
| 11230784 | Electrochemical plating system and method of using | Jun-Nan Nian, Shiu-Ko JangJian, Ting-Chun Wang | 2022-01-25 |