Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456280 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2022-09-27 |
| 11417582 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2022-08-16 |
| 11270927 | Package structure and method of forming the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Wei-Chih Chen | 2022-03-08 |