Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289426 | Semiconductor package and manufacturing method thereof | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu | 2022-03-29 |
| 11276647 | Method of forming semiconductor device | Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-03-15 |