Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289396 | Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2022-03-29 |