Issued Patents 2020
Showing 1–25 of 164 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879183 | Semiconductor device and method of manufacture | Chuei-Tang Wang, Chung-Hao Tsai | 2020-12-29 |
| 10879220 | Package-on-package structure and manufacturing method thereof | Kuo-Chung Yee, Chun-Hui Yu | 2020-12-29 |
| 10878073 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2020-12-29 |
| 10879153 | Chip package structure | Kuo-Chung Yee, Chun-Hui Yu | 2020-12-29 |
| 10872836 | Package structure for heat dissipation | Sung-Feng Yeh, Ming-Fa Chen | 2020-12-22 |
| 10872865 | Electric magnetic shielding structure in packages | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2020-12-22 |
| 10872842 | Semiconductor device and manufacturing method thereof | Albert Wan, Chung-Shi Liu, Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan +1 more | 2020-12-22 |
| 10872878 | Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof | Chuei-Tang Wang, Monsen Liu | 2020-12-22 |
| 10872874 | Bonding apparatus and method of bonding substrates | Ebin Liao, Wen-Chih Chiou | 2020-12-22 |
| 10867958 | Integrated circuit with a thermally conductive underfill | Tien-I Bao | 2020-12-15 |
| 10867832 | Apparatus for holding semiconductor wafers | Chien Ling Hwang | 2020-12-15 |
| 10867879 | Integrated circuit package and method | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2020-12-15 |
| 10867811 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2020-12-15 |
| 10866373 | Optical transceiver and manufacturing method thereof | Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2020-12-15 |
| 10867960 | Device package including molding compound having non-planar top surface around a die and method of forming same | Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2020-12-15 |
| 10869385 | Semiconductor device, circuit board structure and method of fabricating the same | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2020-12-15 |
| 10867965 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang +1 more | 2020-12-15 |
| 10867885 | Heat spreading device and method | Wensen Hung, Ming-Fa Chen, Tsung-Yu Chen | 2020-12-15 |
| 10867874 | Semiconductor device and method | Hui-Jung Tsai, Yun Chen Hsieh, Hung-Jui Kuo | 2020-12-15 |
| 10867936 | Semiconductor device with shield for electromagnetic interference | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen | 2020-12-15 |
| 10867929 | Semiconductor structures and methods of forming the same | Tzuan-Horng Liu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh | 2020-12-15 |
| 10867911 | InFO coil structure and methods of manufacturing same | Tsung-Hsien Chiang, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2020-12-15 |
| 10867982 | Hybrid integrated circuit package and method | Jiun Yi Wu, Hsing-Kuo Hsia | 2020-12-15 |
| 10867939 | Package structure and method of fabricating the same | Cheng-Yu Kuo, Ching-Hua Hsieh, Chung-Shi Liu, Yi-Yang Lei, Wei Huang | 2020-12-15 |
| 10867941 | Semiconductor device and method | Ming-Che Ho, Hung-Jui Kuo, Yi-Wen Wu, Tzung-Hui Lee | 2020-12-15 |