Issued Patents 2020
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872871 | Chip package structure with dummy bump and method for forming the same | Sung-Hui Huang, Kuan-Yu Huang, Yushun Lin, Heh-Chang Huang, Shu-Chia Hsu +2 more | 2020-12-22 |
| 10867954 | Interconnect chips | Kuo-Chiang Ting, Chi-Hsi Wu, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2020-12-15 |
| 10866374 | Optical bench on substrate and method of making the same | Ying-Hao Kuo, Wan-Yu Lee | 2020-12-15 |
| 10866373 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Kuo-Chiang Ting +1 more | 2020-12-15 |
| 10854567 | 3D packages and methods for forming the same | Sao-Ling Chiu, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2020-12-01 |
| 10847485 | Chip package structure and method for forming the same | Kuan-Yu Huang, Sung-Hui Huang | 2020-11-24 |
| 10790254 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu +4 more | 2020-09-29 |
| 10770365 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Wen-Hsin Wei +2 more | 2020-09-08 |
| 10748870 | Tri-layer COWOS structure | Chen-Hua Yu, Yun-Han Lee | 2020-08-18 |
| 10746923 | Photonic semiconductor device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Pin-Tso Lin, Sung-Hui Huang +1 more | 2020-08-18 |
| 10734295 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu +1 more | 2020-08-04 |
| 10720401 | Interconnect chips | Kuo-Chiang Ting, Chi-Hsi Wu, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2020-07-21 |
| 10665474 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shin-Puu Jeng | 2020-05-26 |
| 10663512 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2020-05-26 |
| 10656351 | Package structure for optical fiber and method for forming the same | Sung-Hui Huang, Jui Hsieh Lai | 2020-05-19 |
| 10535633 | Chip package having die structures of different heights and method of forming same | Wen-Hsin Wei, Hsien-Pin Hu | 2020-01-14 |
| 10529679 | 3D packages and methods for forming the same | Sao-Ling Chiu, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2020-01-07 |