Issued Patents 2020
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879194 | Semiconductor device package and method of manufacturing the same | Jing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai, Jeh-Yin Chang, Li-Chung Kuo +3 more | 2020-12-29 |
| 10867849 | Package-on-package structure | Li-Hui Cheng, Chin-Fu Kao, Chih-Yuan Chien | 2020-12-15 |
| 10867965 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin +1 more | 2020-12-15 |
| 10867962 | Packaging process and manufacturing method | Jiun-Ting Chen, Chih-Wei Wu, Ying-Ching Shih | 2020-12-15 |
| 10867955 | Package structure having adhesive layer surrounded dam structure | Li-Hui Cheng, Chin-Fu Kao, Chih-Yuan Chien | 2020-12-15 |
| 10867919 | Electronic device and manufacturing method thereof | Tsung-Fu Tsai, Hou-Ju Huang, Shih-Ting Lin, Hung-Wei Tsai | 2020-12-15 |
| 10861835 | Solution for reducing poor contact in InFO package | Jing-Cheng Lin, Chen-Hua Yu, Shih-Ting Lin, Shin-Puu Jeng | 2020-12-08 |
| 10861799 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Kung-Chen Yeh | 2020-12-08 |
| 10852476 | Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication system | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng | 2020-12-01 |
| 10840215 | Sawing underfill in packaging processes | Ying-Da Wang, Li-Chung Kuo, Jing-Cheng Lin | 2020-11-17 |
| 10818583 | Semiconductor devices, methods of manufacture thereof, and semiconductor device packages | I-Ting Chen, Ying-Ching Shih, Po-Hao Tsai, Jing-Cheng Lin | 2020-10-27 |
| 10804178 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Ying-Ching Shih | 2020-10-13 |
| 10796976 | Semiconductor device and method of forming the same | Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng | 2020-10-06 |
| 10770365 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Shang-Yun Hou, Wen-Hsin Wei +2 more | 2020-09-08 |
| 10756058 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Chih-Wei Wu | 2020-08-25 |
| 10741467 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Jing-Cheng Lin | 2020-08-11 |
| 10679915 | Package structure and manufacturing method thereof | Ping-Yin Hsieh, Chin-Fu Kao, Li-Hui Cheng | 2020-06-09 |
| 10672631 | Method and system for substrate thinning | Yi-Chao Mao, Chin-Chuan Chang | 2020-06-02 |
| 10586763 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Ying-Ching Shih | 2020-03-10 |
| 10529690 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin +1 more | 2020-01-07 |
| 10529637 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Ying-Ching Shih | 2020-01-07 |