Issued Patents 2020
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879194 | Semiconductor device package and method of manufacturing the same | Jing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai, Jeh-Yin Chang, Li-Chung Kuo +3 more | 2020-12-29 |
| 10872862 | Package structure having bridge structure for connection between semiconductor dies and method of fabricating the same | Chih-Wei Wu | 2020-12-22 |
| 10867965 | Package structures and methods of forming the same | Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang +1 more | 2020-12-15 |
| 10867962 | Packaging process and manufacturing method | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu | 2020-12-15 |
| 10861799 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Szu-Wei Lu, Kung-Chen Yeh | 2020-12-08 |
| 10847414 | Embedded 3D interposer structure | Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2020-11-24 |
| 10818583 | Semiconductor devices, methods of manufacture thereof, and semiconductor device packages | I-Ting Chen, Po-Hao Tsai, Szu-Wei Lu, Jing-Cheng Lin | 2020-10-27 |
| 10804178 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Szu-Wei Lu | 2020-10-13 |
| 10770365 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou +2 more | 2020-09-08 |
| 10756058 | Semiconductor package and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu | 2020-08-25 |
| 10586763 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu | 2020-03-10 |
| 10535639 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Pu Wang, Chen-Hua Yu | 2020-01-14 |
| 10529637 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Szu-Wei Lu | 2020-01-07 |
| 10529690 | Package structures and methods of forming the same | Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang +1 more | 2020-01-07 |