Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872871 | Chip package structure with dummy bump and method for forming the same | Sung-Hui Huang, Kuan-Yu Huang, Shang-Yun Hou, Yushun Lin, Heh-Chang Huang +2 more | 2020-12-22 |
| 10861799 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Szu-Wei Lu | 2020-12-08 |