Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872871 | Chip package structure with dummy bump and method for forming the same | Sung-Hui Huang, Shang-Yun Hou, Yushun Lin, Heh-Chang Huang, Shu-Chia Hsu +2 more | 2020-12-22 |
| 10866373 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2020-12-15 |
| 10867951 | Semiconductor device | Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Pai Yuan Li, Sung-Hui Huang +2 more | 2020-12-15 |
| 10847485 | Chip package structure and method for forming the same | Sung-Hui Huang, Shang-Yun Hou | 2020-11-24 |
| 10790254 | Chip package structure | Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu, Shang-Yun Hou +4 more | 2020-09-29 |
| 10770405 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Pai Yuan Li, Hsiang-Fan Lee | 2020-09-08 |
| 10707177 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Pai Yuan Li, Hsiang-Fan Lee | 2020-07-07 |
| 10629545 | Semiconductor device | Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee, Szu-Po Huang | 2020-04-21 |