Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872871 | Chip package structure with dummy bump and method for forming the same | Sung-Hui Huang, Kuan-Yu Huang, Shang-Yun Hou, Yushun Lin, Heh-Chang Huang +2 more | 2020-12-22 |
| 10867951 | Semiconductor device | Kuan-Yu Huang, Tzu-Kai Lan, Shou-Chih Yin, Pai Yuan Li, Sung-Hui Huang +2 more | 2020-12-15 |
| 10790254 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Leu-Jen Chen, Yi-Wei Liu, Shang-Yun Hou +4 more | 2020-09-29 |
| 10629545 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Pai Yuan Li, Hsiang-Fan Lee, Szu-Po Huang | 2020-04-21 |