Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872871 | Chip package structure with dummy bump and method for forming the same | Sung-Hui Huang, Kuan-Yu Huang, Shang-Yun Hou, Yushun Lin, Shu-Chia Hsu +2 more | 2020-12-22 |
HH
Heh-Chang Huang
Overall (2020): #453,066 of 565,922Top 85%
1
Patents 2020