Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872871 | Chip package structure with dummy bump and method for forming the same | Kuan-Yu Huang, Shang-Yun Hou, Yushun Lin, Heh-Chang Huang, Shu-Chia Hsu +2 more | 2020-12-22 |
| 10867951 | Semiconductor device | Kuan-Yu Huang, Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Pai Yuan Li +2 more | 2020-12-15 |
| 10866373 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Kuan-Yu Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2020-12-15 |
| 10847485 | Chip package structure and method for forming the same | Kuan-Yu Huang, Shang-Yun Hou | 2020-11-24 |
| 10790254 | Chip package structure | Kuan-Yu Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu, Shang-Yun Hou +4 more | 2020-09-29 |
| 10770405 | Thermal interface material having different thicknesses in packages | Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee | 2020-09-08 |
| 10746923 | Photonic semiconductor device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Pin-Tso Lin, Shang-Yun Hou +1 more | 2020-08-18 |
| 10707177 | Thermal interface material having different thicknesses in packages | Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee | 2020-07-07 |
| 10656351 | Package structure for optical fiber and method for forming the same | Jui Hsieh Lai, Shang-Yun Hou | 2020-05-19 |
| 10629545 | Semiconductor device | Kuan-Yu Huang, Pai Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee, Szu-Po Huang | 2020-04-21 |