Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770405 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee | 2020-09-08 |
| 10707177 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee | 2020-07-07 |