Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867951 | Semiconductor device | Kuan-Yu Huang, Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Pai Yuan Li +2 more | 2020-12-15 |
| 10770405 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li | 2020-09-08 |
| 10707177 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li | 2020-07-07 |
| 10629510 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2020-04-21 |
| 10629545 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Szu-Po Huang | 2020-04-21 |