Issued Patents 2020
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867954 | Interconnect chips | Kuo-Chiang Ting, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2020-12-15 |
| 10868166 | Highly strained source/drain trenches in semiconductor devices | Ta-Wei Kao, Shiang-Bau Wang, Ming-Jie Huang, Shu-Yuan Ku | 2020-12-15 |
| 10867965 | Package structures and methods of forming the same | Ying-Ching Shih, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang +1 more | 2020-12-15 |
| 10867900 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2020-12-15 |
| 10866373 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Kuo-Chiang Ting +1 more | 2020-12-15 |
| 10825780 | Semiconductor device with electromagnetic interference protection and method of manufacture | Hsien-Wei Chen, Li-Hsien Huang, Tien-Chung Yang | 2020-11-03 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2020-10-20 |
| 10796927 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2020-10-06 |
| 10784207 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2020-09-22 |
| 10770365 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou +2 more | 2020-09-08 |
| 10746923 | Photonic semiconductor device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Pin-Tso Lin, Sung-Hui Huang +1 more | 2020-08-18 |
| 10741512 | Semiconductor package and method of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2020-08-11 |
| 10720401 | Interconnect chips | Kuo-Chiang Ting, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2020-07-21 |
| 10714426 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2020-07-14 |
| 10700045 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2020-06-30 |
| 10679951 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su | 2020-06-09 |
| 10643965 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2020-05-05 |
| 10643864 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2020-05-05 |
| 10636775 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai +2 more | 2020-04-28 |
| 10629510 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Shin-Puu Jeng | 2020-04-21 |
| 10629537 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2020-04-21 |
| 10629477 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2020-04-21 |
| 10622297 | Semiconductor device and method | Jing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai | 2020-04-14 |
| 10622302 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2020-04-14 |
| 10546786 | Method of fabricating a FinFET device | Joanna Chaw Yane Yin, Kuo-Chiang Ting, Kuang-Hsin Chen | 2020-01-28 |