Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818615 | Semiconductor structure | Hsien-Wei Chen, Ming-Fa Chen | 2020-10-27 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2020-10-20 |
| 10797001 | Three-dimensional integrated circuit structures | Jie Chen, Hsien-Wei Chen | 2020-10-06 |
| 10718771 | Recombinant baculoviruses and their uses in detecting arthropod-borne virus | Tzong-Yuan Wu, Szu-Cheng KUO, Pei-Yun SHU, Chang-Chi LIN, Der-Jiang CHIAO +3 more | 2020-07-21 |
| 10720385 | Semiconductor structure | Hsien-Wei Chen | 2020-07-21 |
| 10665540 | Redistribution layer structures for integrated circuit package | Jie Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2020-05-26 |
| 10658339 | Semiconductor device and method of manufacture | Hsien-Wei Chen, An-Jhih Su, Jie Chen | 2020-05-19 |
| 10651131 | Supporting InFO packages to reduce warpage | Jie Chen, Hsien-Wei Chen | 2020-05-12 |
| 10643965 | Structure and method of forming a joint assembly | An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2020-05-05 |
| 10629560 | Semiconductor structure | Jie Chen, Hsien-Wei Chen | 2020-04-21 |