Issued Patents 2020
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10880548 | Methods and apparatuses for encoding and decoding video according to coding order | Yin-ji Piao, Chan-yul Kim | 2020-12-29 |
| 10879138 | Semiconductor packaging structure including interconnection to probe pad with probe mark and method of manufacturing the same | Hsien-Wei Chen, Ching-Jung Yang | 2020-12-29 |
| 10872865 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2020-12-22 |
| 10867967 | Chip package with redistribution layers | Hsien-Wei Chen | 2020-12-15 |
| 10817372 | Systems and methods for ultra fast ECC with parity | Zining Wu | 2020-10-27 |
| 10811390 | Die stack structure and method of fabricating the same and package | Hsien-Wei Chen, Ming-Fa Chen | 2020-10-20 |
| 10798375 | Encoding method and device therefor, and decoding method and device therefor | Yin-ji Piao, Chan-yul Kim | 2020-10-06 |
| 10797001 | Three-dimensional integrated circuit structures | Hsien-Wei Chen, Ying-Ju Chen | 2020-10-06 |
| 10756007 | Pad design for reliability enhancement in packages | Hsien-Wei Chen | 2020-08-25 |
| 10750201 | Encoding method, decoding method and device for video global disparity vector | Jun Zhang | 2020-08-18 |
| 10740008 | Memory and data reading method including performing N read operations on an address and determining whether the data is consistent | Mingguang Wang, Yu Liu | 2020-08-11 |
| 10741512 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen | 2020-08-11 |
| 10719394 | Systems and methods for fast access of non-volatile storage devices | Zining Wu | 2020-07-21 |
| 10715182 | Systems and methods for decoding error correcting codes with self-generated LLR | Chung-Li Wang, Zining Wu | 2020-07-14 |
| 10700040 | Discrete polymer in fan-out packages | Hsien-Wei Chen | 2020-06-30 |
| 10665572 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen | 2020-05-26 |
| 10665540 | Redistribution layer structures for integrated circuit package | Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2020-05-26 |
| 10658339 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Ying-Ju Chen, An-Jhih Su | 2020-05-19 |
| 10651131 | Supporting InFO packages to reduce warpage | Ying-Ju Chen, Hsien-Wei Chen | 2020-05-12 |
| 10629555 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen | 2020-04-21 |
| 10629560 | Semiconductor structure | Hsien-Wei Chen, Ying-Ju Chen | 2020-04-21 |
| 10623773 | Method and device for encoding and decoding intra-frame skip mode information | Jin Young Lee | 2020-04-14 |
| 10585094 | Devices and methods for nanoparticle enhanced impedance-based molecular sensing | Scott MacKay, Peter Hermansen, David Wishart | 2020-03-10 |
| 10574274 | Systems and methods for decoding error correcting codes | Yuan-Mao Chang, Chung-Li Wang | 2020-02-25 |
| 10572499 | Displaying a hierarchical data structure within a graphical user interface | Li Zhang, Jie Jiang, Wen Juan Nie, Zai Cen, Ke Yin +1 more | 2020-02-25 |