Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879198 | Package with solder regions aligned to recesses | Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2020-12-29 |
| 10879138 | Semiconductor packaging structure including interconnection to probe pad with probe mark and method of manufacturing the same | Hsien-Wei Chen, Jie Chen | 2020-12-29 |
| 10867968 | 3DIC structure with protective structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen | 2020-12-15 |
| 10854564 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang | 2020-12-01 |
| 10840190 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2020-11-17 |
| 10825804 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Yu-Chia Lai | 2020-11-03 |
| 10658290 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Chia-Wei Tu | 2020-05-19 |
| 10636757 | Integrated circuit component package and method of fabricating the same | Ming-Yen Chiu | 2020-04-28 |