Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879201 | Semiconductor package for wafer level packaging and manufacturing method thereof | Shou-Yi Wang, Tsung-Shu Lin | 2020-12-29 |
| 10879185 | Package structure with bump | Hsin-Chieh Huang, Ching Fu Chang | 2020-12-29 |
| 10811389 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh | 2020-10-20 |
| 10790235 | Integrated fan-out package and method of fabricating the same | Ching Fu Chang, Hsin-Chieh Huang | 2020-09-29 |
| 10770402 | Integrated fan-out package | Ching Fu Chang, Hsin-Chieh Huang | 2020-09-08 |
| 10756038 | Semiconductor package and manufacturing method thereof | Shou-Yi Wang, Tsung-Shu Lin | 2020-08-25 |
| 10734299 | Package with tilted interface between device die and encapsulating material | Hsin-Chieh Huang, Ching Fu Chang | 2020-08-04 |
| 10636757 | Integrated circuit component package and method of fabricating the same | Ching-Jung Yang | 2020-04-28 |