Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879201 | Semiconductor package for wafer level packaging and manufacturing method thereof | Ming-Yen Chiu, Tsung-Shu Lin | 2020-12-29 |
| 10756038 | Semiconductor package and manufacturing method thereof | Ming-Yen Chiu, Tsung-Shu Lin | 2020-08-25 |