Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879201 | Semiconductor package for wafer level packaging and manufacturing method thereof | Ming-Yen Chiu, Shou-Yi Wang | 2020-12-29 |
| 10833030 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Wei-Cheng Wu | 2020-11-10 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Chin-Chuan Chang +5 more | 2020-10-20 |
| 10756038 | Semiconductor package and manufacturing method thereof | Ming-Yen Chiu, Shou-Yi Wang | 2020-08-25 |
| 10714426 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2020-07-14 |
| 10700033 | Packaging device and method of making the same | Chang-Chia Huang, Ming-Da Cheng, Wen-Hsiung Lu, Bor-Rung Su | 2020-06-30 |
| 10679953 | Integrated fan-out structure and method of forming | Hsien-Wei Chen, An-Jhih Su | 2020-06-09 |