Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811369 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2020-10-20 |
| 10770366 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Yian-Liang Kuo | 2020-09-08 |
| 10714442 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2020-07-14 |
| 10700033 | Packaging device and method of making the same | Chang-Chia Huang, Tsung-Shu Lin, Ming-Da Cheng, Bor-Rung Su | 2020-06-30 |
| 10665565 | Package assembly | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Ming-Da Cheng, Chung-Shi Liu | 2020-05-26 |
| 10651142 | Micro-connection structure and manufacturing method thereof | Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang, Kai Jun Zhan | 2020-05-12 |