Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsiu-Jen Lin, Kai-Chiang Wu, Ming-Che Ho, Wei-Yu Chen +8 more | 2020-12-15 |
| 10861827 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng | 2020-12-08 |
| 10714442 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2020-07-14 |
| 10535644 | Manufacturing method of package on package structure | Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2020-01-14 |