Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879203 | Stud bump structure for semiconductor package assemblies | Hsiu-Jen Lin, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2020-12-29 |
| 10867960 | Device package including molding compound having non-planar top surface around a die and method of forming same | Chen-Hua Yu, Ming-Da Cheng, Chung-Shi Liu | 2020-12-15 |
| 10861827 | 3D package structure and methods of forming same | Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2020-12-08 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng, Kuo Lung Pan +3 more | 2020-11-17 |
| 10832999 | Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Ming-Da Cheng +1 more | 2020-11-10 |
| 10818614 | Package structure | Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Hao-Cheng Hou, Jung Wei Cheng | 2020-10-27 |
| 10797025 | Advanced INFO POP and method of forming thereof | Yi-Da Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng +2 more | 2020-10-06 |
| 10741508 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Sheng-Hsiang Chiu | 2020-08-11 |
| 10600709 | Bump-on-trace packaging structure and method for forming the same | Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng +1 more | 2020-03-24 |
| 10559546 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Wei-Hung Lin | 2020-02-11 |