Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879197 | Package structure and method of fabricating package structure | Chung-Shi Liu, Chao-Wen Shih, Han-Ping Pu, Chien Ling Hwang | 2020-12-29 |
| 10872842 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan +1 more | 2020-12-22 |
| 10867882 | Semiconductor package, semiconductor device and method for packaging semiconductor device | Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu | 2020-12-15 |
| 10867940 | Package structure and manufacturing method thereof | Chao-Wen Shih, Shou-Zen Chang, Nan-Chin Chuang | 2020-12-15 |
| 10756052 | Method of manufacturing integrated fan-out package | Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2020-08-25 |
| 10741508 | Semiconductor device having antenna and manufacturing method thereof | Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen, Sheng-Hsiang Chiu | 2020-08-11 |
| 10636713 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Yu-Sheng Hsieh | 2020-04-28 |