Issued Patents 2020
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879183 | Semiconductor device and method of manufacture | Chuei-Tang Wang, Chen-Hua Yu | 2020-12-29 |
| 10867938 | Package structure | Tzu-Chun Tang, Chen-Hua Yu, Chuei-Tang Wang | 2020-12-15 |
| 10818640 | Die stacks and methods forming same | Chen-Hua Yu, Chuei-Tang Wang | 2020-10-27 |
| 10811404 | Package structure and method of manufacturing the same | Shih-Ya Huang, Chen-Hua Yu, Chuei-Tang Wang | 2020-10-20 |
| 10796990 | Semiconductor structure, package structure, and manufacturing method thereof | Wei-Ting Chen, Chen-Hua Yu, Chuei-Tang Wang | 2020-10-06 |
| 10777502 | Semiconductor chip, package structure, and pacakge-on-package structure | Chuei-Tang Wang, Chen-Hua Yu, Wei-Ting Chen | 2020-09-15 |
| 10770795 | Antenna device and method for manufacturing antenna device | Chuei-Tang Wang, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu | 2020-09-08 |
| 10770313 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chun-Lin Lu, Yen-Ping Wang, Che-Wei Hsu | 2020-09-08 |
| 10763164 | Package structure with inductor and method of forming thereof | Chih-Lin Chen, Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang | 2020-09-01 |
| 10756052 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2020-08-25 |
| 10734323 | Package structures | Chun-Wen Lin, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu | 2020-08-04 |
| 10692817 | Semiconductor device with shielding structure for cross-talk reduction | Shih-Ya Huang, Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang | 2020-06-23 |
| 10679968 | Package with thinned substrate | Chen-Hua Yu, Chuei-Tang Wang | 2020-06-09 |
| 10607856 | Manufacturing method of redistribution layer | Kun-Yung Huang, Chih-Fu Lung, Shih-Chi Li, Mei-Chen Lee, Chi-Liang Wang | 2020-03-31 |