Issued Patents 2020
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879183 | Semiconductor device and method of manufacture | Chung-Hao Tsai, Chen-Hua Yu | 2020-12-29 |
| 10872878 | Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof | Monsen Liu, Chen-Hua Yu | 2020-12-22 |
| 10867938 | Package structure | Tzu-Chun Tang, Chung-Hao Tsai, Chen-Hua Yu | 2020-12-15 |
| 10867936 | Semiconductor device with shield for electromagnetic interference | Chen-Hua Yu, Wei-Ting Chen, Chieh-Yen Chen | 2020-12-15 |
| 10847304 | InFO coil on metal plate with slot | Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo +1 more | 2020-11-24 |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2020-11-17 |
| 10825602 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2020-11-03 |
| 10818640 | Die stacks and methods forming same | Chen-Hua Yu, Chung-Hao Tsai | 2020-10-27 |
| 10811404 | Package structure and method of manufacturing the same | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu | 2020-10-20 |
| 10804953 | Method of using integrated transmitter and receiver front end module | En-Hsiang Yeh, Monsen Liu | 2020-10-13 |
| 10796990 | Semiconductor structure, package structure, and manufacturing method thereof | Wei-Ting Chen, Chung-Hao Tsai, Chen-Hua Yu | 2020-10-06 |
| 10777518 | Package structure and method of manufacturing the same | Chen-Hua Yu, Tzu-Chun Tang, Chieh-Yen Chen, Che-Wei Hsu | 2020-09-15 |
| 10777502 | Semiconductor chip, package structure, and pacakge-on-package structure | Chung-Hao Tsai, Chen-Hua Yu, Wei-Ting Chen | 2020-09-15 |
| 10770795 | Antenna device and method for manufacturing antenna device | Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu | 2020-09-08 |
| 10763229 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Hao-Yi Tsai, Chen-Hua Yu, Wei-Ting Chen +2 more | 2020-09-01 |
| 10763164 | Package structure with inductor and method of forming thereof | Chih-Lin Chen, Chung-Hao Tsai, Jeng-Shien Hsieh, Chen-Hua Yu, Chih-Yuan Chang | 2020-09-01 |
| 10756052 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chao-Wen Shih, Han-Ping Pu +5 more | 2020-08-25 |
| 10734323 | Package structures | Chun-Wen Lin, Chung-Hao Tsai, Chen-Hua Yu, Che-Wei Hsu | 2020-08-04 |
| 10727082 | Semiconductor device and manufacturing method thereof | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen +3 more | 2020-07-28 |
| 10692817 | Semiconductor device with shielding structure for cross-talk reduction | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu, Chih-Yuan Chang | 2020-06-23 |
| 10679947 | Chip package and manufacturing method thereof | Chen-Hua Yu | 2020-06-09 |
| 10679968 | Package with thinned substrate | Chen-Hua Yu, Chung-Hao Tsai | 2020-06-09 |
| 10672728 | Integrated fan-out package | Tzu-Chun Tang, Chieh-Yen Chen, Che-Wei Hsu | 2020-06-02 |
| 10665560 | Optical semiconductor package and method for manufacturing the same | Chih-Chieh Chang, Yu-Kuang Liao, Hsing-Kuo Hsia, Chih-Yuan Chang, Jeng-Shien Hsieh +1 more | 2020-05-26 |
| 10643943 | Package structure, package-on-package structure and manufacturing method thereof | Tin-Hao Kuo | 2020-05-05 |