Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861841 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Chi-Hui Lai, Ban-Li Wu +2 more | 2020-12-08 |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Chih-Hsuan Tai +5 more | 2020-11-17 |
| 10832985 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2020-11-10 |
| 10762319 | Fingerprint sensor and manufacturing method thereof | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu +1 more | 2020-09-01 |
| 10672729 | Package structure and method of forming package structure | Chih-Hsuan Tai, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2020-06-02 |
| 10658348 | Semiconductor devices having a plurality of first and second conductive strips | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Yu-Chih Huang +4 more | 2020-05-19 |