Issued Patents 2020
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879203 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Hsiu-Jen Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2020-12-29 |
| 10879192 | Semiconductor structure and manufacturing method thereof | Hsaing-Pin Kuan, Ching-Hua Hsieh, Chun-Cheng Lin, Yu-Wei Lin, Chun-Yen Lan | 2020-12-29 |
| 10867953 | Manufacturing method of integrated fan-out package | Ai-Tee Ang, Shing-Chao Chen, Ching-Hua Hsieh, Ching-Yao Lin | 2020-12-15 |
| 10867932 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2020-12-15 |
| 10861692 | Substrate carrier deterioration detection and repair | Jen-Ti Wang, Fu-Hsien Li, Yi-Ming Chen, Cheng-Ho Hung | 2020-12-08 |
| 10861827 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2020-12-08 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng, Kuo Lung Pan +3 more | 2020-11-17 |
| 10832999 | Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2020-11-10 |
| 10818614 | Package structure | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Hao-Cheng Hou, Jung Wei Cheng | 2020-10-27 |
| 10750644 | Rear side swappable fan array module design | Chao-Jung Chen, Ming-Lun Ku | 2020-08-18 |
| 10700025 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2020-06-30 |
| 10672729 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2020-06-02 |
| 10658315 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chun-Chih Lin | 2020-05-19 |
| 10642319 | Flexible stacked up chassis | Chao-Jung Chen, Ming-Lun Ku | 2020-05-05 |
| 10636873 | Method of fabricating semiconductor device | Tsung-Han Lin, Chao-Wei Wu, Yen-Kai Chen | 2020-04-28 |
| 10636715 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu | 2020-04-28 |
| 10629508 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2020-04-21 |
| 10622240 | Package on-package structure | Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2020-04-14 |
| 10600709 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng +1 more | 2020-03-24 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2020-02-18 |
| 10535609 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2020-01-14 |