Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10844477 | Electromagnetic module for physical vapor deposition | Hsuan-Chih Chu, Chien-Hsun Pan, Chun-Chih Lin | 2020-11-24 |
| 10790196 | Threshold voltage tuning for fin-based integrated circuit device | Chung-Liang Cheng, Wei-Jen Chen, Ming-Hsien Lin | 2020-09-29 |
| 10752995 | Material delivery system and method | Ke-Chih Liu, Chia-Ming Tsai, Yueh-Ching Pai, Yu-Min Chang | 2020-08-25 |
| 10748806 | Apparatus and system for preventing backside peeling defects on semiconductor wafers | Wei-Jen Chen, Yi-Chen Chiang, Tsang-Yang Liu, Chang-Sheng Lee, Wei-Chen Liao +1 more | 2020-08-18 |
| 10712781 | Casing assembly and electronic device having the same | San-Feng Lin | 2020-07-14 |
| 10696356 | Driving device for a hub assembly | Yen-Shen Chen, Yen-Ching Chen | 2020-06-30 |
| 10658315 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin | 2020-05-19 |
| 10651066 | Metrology method in wafer transportation | Powen Huang, Yao-Yuan SHANG, Kuo-Shu Tseng, Chun-Chih Lin, Yi-Ming Dai | 2020-05-12 |
| 10651292 | Dual metal via for contact resistance reduction | Chung-Liang Cheng | 2020-05-12 |