Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658315 | Redistribution layer metallic structure and method | Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin | 2020-05-19 |
SB
Shih Wei Bih
Overall (2020): #278,497 of 565,922Top 50%
1
Patents 2020