Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658315 | Redistribution layer metallic structure and method | Shih Wei Bih, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin | 2020-05-19 |
| 10541218 | Redistribution layer structure and fabrication method therefor | Anhao Cheng, Chun-Chang Liu | 2020-01-21 |